• Laser Cutting Equipment Manufacturer for Hardware Accessories/Electronic Devices/Instruments
  • Laser Cutting Equipment Manufacturer for Hardware Accessories/Electronic Devices/Instruments
  • Laser Cutting Equipment Manufacturer for Hardware Accessories/Electronic Devices/Instruments
  • Laser Cutting Equipment Manufacturer for Hardware Accessories/Electronic Devices/Instruments
  • Laser Cutting Equipment Manufacturer for Hardware Accessories/Electronic Devices/Instruments
  • Laser Cutting Equipment Manufacturer for Hardware Accessories/Electronic Devices/Instruments

Laser Cutting Equipment Manufacturer for Hardware Accessories/Electronic Devices/Instruments

After-sales Service: Provided
Warranty: Provided
Application: Home Appliance, Environmental Equipment, Automotive Industry, Advertising Industry
Cooling System: Water Cooling
Technical Class: Continuous Wave Laser
Applicable Material: Metal
Customization:
Gold Member Since 2023

Suppliers with verified business licenses

Jiangsu, China
QA/QC Inspectors
The supplier has 1 QA and QC inspection staff
R&D Capabilities
The supplier has 1 R&D engineers, you can check the Audit Report for more information
to see all verified strength labels (14)
  • Overview
  • Product Description
  • Exhibition & Customers
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Model NO.
Mps-0303l
Product Name
Precision Laser Cutting Machine
Feature 1
Guaranteed Quality
Feature 2
Customized According to Needs
After-Sale Service
Provided
Transport Package
Customized or Wooden Box Packaging
Specification
Standard Specifications
Trademark
Himalaya
Origin
China

Product Description

 
Product Description
Laser Cutting Equipment Manufacturer for Hardware Accessories/Electronic Devices/Instruments

Mps-0303l precision laser cutting machine is a linear motor platform, with high precision, high speed, good cutting quality, processing width of 300 mm × 300 mm, which can be used in precision cutting. The equipment adopts imported laser and cutting head to ensure the stability of cutting, and adopts transmission parts of international famous brands to ensure the accuracy and processing speed of the machine tool.

Product features:
1. Linear motor platform, better mechanical performance, speed, acceleration and machining accuracy are improved.
2. The gantry installation platform adopts marble structure, which can effectively prevent vibration and is more suitable for high-speed movement with better stability.
3. The z-axis sliding table is directly cast, which effectively ensures the rigidity of the sliding table, reduces the vibration of the machine tool in the process of movement, and improves the machining accuracy of the machine tool.
4. The main bed adopts welding structure, after annealing to eliminate internal stress, finish machining, better solve the stress caused by welding and processing, so as to greatly improve the rigidity and stability of the equipment.
5. Better stability and longer service life.
6. Excellent processing system, friendly interface, easy operation, and real-time feedback of processing status, which ensures the orderly processing.

Laser Cutting Equipment Manufacturer for Hardware Accessories/Electronic Devices/Instruments
Application fields:
It is suitable for the processing of spectacle frame, hardware accessories, electronic devices, instruments, gold and silver jewelry industry.
Exhibition & Customers

Laser Cutting Equipment Manufacturer for Hardware Accessories/Electronic Devices/InstrumentsLaser Cutting Equipment Manufacturer for Hardware Accessories/Electronic Devices/InstrumentsJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

Laser Cutting Equipment Manufacturer for Hardware Accessories/Electronic Devices/Instruments
FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

Send your message to this supplier

*From:
*To:
*Message:

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now