| Customization: | Available |
|---|---|
| After-sales Service: | Provide |
| Condition: | New |
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1,Index parameter
Rated temperature: 850 degrees centigrade; maximum temperature: 1050 C
Effective height: 140mm
Net band width: 700mm
Furnace structure: large furnace chamber, super light insulation material masonry structure.
Maximum load: 50Kg/
Speed range: 70 ~ 400mm/min, typical belt speed: 170 ~ 250mm/min; variable frequency stepless speed regulation.
Heating elements: infrared tube FEC heater heating, heating on the drying area, heating up and down in the sintering area.
Sintering atmosphere: dry compressed air
Gas path composition: 11 way intake, each flow can be adjusted (see 3.2 technical specification).
Cooling mode: cooling by heat insulation, air cooling and water cooling, cooling water jacket 1 points water temperature detection.
Temperature control stability: + 1 c
2,Progressiveness
According to the process requirements, the lamp tube and FEC ceramic fiber heater are heated. According to the technology of LTCC, thick film heater and chip element, the drying and sintering temperature zone and gas path are adjusted. The position and quantity of the exhaust port are determined according to the size of the discharge, the temperature and speed are accurately controlled, the light material is used in the ring protection, the energy saving and environmental protection, and the convenience and reliability are used. Long life.
3,Scene and detail display
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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