| Customization: | Available |
|---|---|
| After-sales Service: | 1 Year |
| Warranty: | 1 Year |
Suppliers with verified business licenses
Audited Supplier Audited by an independent third-party inspection agency
Specifications:
| Applicable materials | Low-k, metal, ceramic, glass, etc. |
| Laser type | DPSS ultraviolet laser |
| Laser power | ≥5W |
| Cooling method | Closed-loop water cooling |
| Grooving depth | >10μm |
| Cutting-axis speed | 0-800mm/s |
| Applicable wafer size | 12 inches |
| Upper surface precision | 0.01mm/300mm |
| Cleaning plate rotation speed | 2500r/min |
| Rotational accuracy | 0.01° |
| Processing method | Automatic front-side grooving |
| Focusing mode | Auto-focusing |
| Lighting system | Point light source |
Advantages:
1. Effectively reduce edge collapse and delamination, improving yield.
2. Grooving width and depth are adjustable.
Applications:
1. Surface grooving of low-k wafer used in the 40nm or smaller process.
2. Surface scribing or grooving of semiconductor wafer.
Samples:
){kind=link}