| Customization: | Available |
|---|---|
| After-sales Service: | Provided |
| Warranty: | Provided |
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Product introduction:
The MPS-C series laser cutting machine is equipped with imported servo drives and a large family of super customized systems, greatly meeting the needs of customers.
Product characteristics:
1. A complete quality system, stable and reliable products, disc reducers, taking into account both speed and acceleration. Equipment motors, reducers, and other equipment are all made of industry-leading brands.
2. Adopting a dual drive gantry structure, high-quality steel welded bed, honeycomb shaped high-strength crossbeam, combined with excellent heat treatment and machining processes, ensuring the rigidity of the machine tool while ensuring the high-quality dynamic performance of the equipment.
3. Integrated and highly integrated design, effectively reducing user usage costs.
4. Adopting a professional control system independently developed by hanslaser, after 20 years of mature use and continuous optimization in the field of laser cutting, the control system has achieved high performance, high reliability, and user-friendly and convenient operation.
5. High speed parallel exchange platform greatly improves processing efficiency. It can be equipped with an intelligent monitoring system and supports automatic loading and unloading expansion function.
Applicable industries:
Various machinery manufacturing and processing industries include rail transit, shipbuilding, automobiles, engineering machinery, agricultural and forestry machinery, electrical manufacturing, elevator manufacturing, household appliances, grain machinery, textile machinery, tool processing, petroleum machinery, food machinery, kitchenware and bathroom, decorative advertising, laser external processing services, etc.
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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