| Customization: | Available |
|---|---|
| After-sales Service: | Provide |
| Condition: | New |
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Application introduction:
Widely used in scientific research and production units such as aviation, aerospace, petroleum, chemical industry, shipbuilding, electronics, communications, etc., mainly used for BPO glue/PI glue/BCB glue curing, IC (wafer, CMOS, Bumping, TSV, MEMS, fingerprint identification) , FPD, high-precision electronic components, electronic ceramic materials dust-free drying, drying and aging tests of electrical products, materials, spare parts, etc. in high-temperature clean and oxygen-free environments.
main feature:
The box body is made of full ceramic fiber insulation, which has the characteristics of fast heating and energy saving. It has a unique air supply and exhaust system.
Make sure the temperature of the furnace box is uniform, and add a fiberglass filter to the air suction port to ensure cleanliness requirements.
1. Technical indicators and basic configuration:
1.1 Operating temperature: RT+10~400ºC, maximum temperature: 450ºC;
1.2 Empty furnace cooling time: 375ºC--80ºC; cooling time 1.5-3.5 hours (using water cooling and air cooling);
1.3 Temperature uniformity: ±2%ºC (400ºC platform).
2. Oxygen content (oxygen analyzer):
High temperature state oxygen content: ≤ 50ppm + gas source oxygen content;
Low temperature state oxygen content: ≤100ppm + gas source oxygen content.
3. Event output:
3.1 Equipped with PLC, it can realize multi-event output control of atmosphere, water and other switches and alarms;
3.2 Control: The furnace cavity can be individually controlled for temperature, ventilation, and alarm protection;
4. Process line standards:
Raise the temperature at room temperature at a heating rate of 3-5°C/min for 40 minutes to reach 200°C → 200°C at a constant temperature.
45 minutes → then raise to 375ºC in 40min → constant temperature at 375ºC for 1H → finally decrease by 3-5ºC per minute
The temperature rate dropped from 375ºC to 75ºC in about 79 minutes.
Custom or multi-cavity acceptable
5. Product model:
|
model |
MOLWY-120 |
MOLWY-288 |
MOLWY-512 |
|
Inner dimensions (mm) |
W450*H650*D450 |
W600*H800*D600 |
W800*H800*D800 |
|
Number of layers |
Second floor |
||
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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