Zbs-300d Vacuum Baking Equipment for Mems, Power Semiconductor, Advanced Packaging and Optoelectronic Fields

Product Details
Customization: Available
After-sales Service: Provide
Warranty: 12 Months
Gold Member Since 2023

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  • Zbs-300d Vacuum Baking Equipment for Mems, Power Semiconductor, Advanced Packaging and Optoelectronic Fields
  • Zbs-300d Vacuum Baking Equipment for Mems, Power Semiconductor, Advanced Packaging and Optoelectronic Fields
  • Zbs-300d Vacuum Baking Equipment for Mems, Power Semiconductor, Advanced Packaging and Optoelectronic Fields
  • Zbs-300d Vacuum Baking Equipment for Mems, Power Semiconductor, Advanced Packaging and Optoelectronic Fields
  • Zbs-300d Vacuum Baking Equipment for Mems, Power Semiconductor, Advanced Packaging and Optoelectronic Fields
  • Zbs-300d Vacuum Baking Equipment for Mems, Power Semiconductor, Advanced Packaging and Optoelectronic Fields
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  • Overview
  • Product Description
  • Exhibition & Customers
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Model NO.
ZBS-300D
Product Name
Vjs-80 Vacuum Purification (Degassing) Furnace
Feature
Convenient Maintenance a
Certification
ISO
Condition
New
Transport Package
Customized or Wooden Box Packaging
Specification
Standard Specifications
Trademark
Himalaya
Origin
China

Product Description

Product Description
  
Zbs-300d Vacuum Baking Equipment for Mems, Power Semiconductor, Advanced Packaging and Optoelectronic Fields
VJS-80 vacuum purification (degassing) furnace

VJS-80 vacuum purification furnace is mainly used for vacuum purification, degassing and annealing of electromagnetic pure iron for ceramic substrate, Kovar material, relay and electrical connector parts; it is also suitable for vacuum brazing of Kovar alloy, stainless steel and other materials, and vacuum sintering of ceramic materials.The equipment has reliable performance, accurate temperature control, simple maintenance and automatic operation.The process control computer is equipped with touch screen, which is convenient for users to operate, edit process icon and store formula.The utility model has the advantages of high production efficiency and low energy consumption.It has the advantages of less pollution, convenient maintenance and use.
Zbs-300d Vacuum Baking Equipment for Mems, Power Semiconductor, Advanced Packaging and Optoelectronic Fields

ZRS series vacuum hot pressing furnace

ZRS series vacuum hot pressing furnace is suitable for high temperature and high pressure sintering of high temperature ceramics and photoelectic materials. The utility model can be also be used for pressure diffusion welding of different metal materials, different ceramic materials, ceramic materials and metals. According to the use of the temperature is roughly divided into 800 degrees below the furnace, a furnace of 1000--1600 degrees celsius, 1600--2000 degrees celsius. Products can be customized according to user needs.
 
 
Zbs-300d Vacuum Baking Equipment for Mems, Power Semiconductor, Advanced Packaging and Optoelectronic Fields
Vacuum Welding Cabinet With Argon

Mainly provide an anoxic condition for welding of titanium al-loy and other active metals. The buildin welding positioner can achieve longitudinal seam welding manually, and circumferential seam welding interchanaeable parts of weld gun are Air-cooling and water-cooling, and easy to change.
Zbs-300d Vacuum Baking Equipment for Mems, Power Semiconductor, Advanced Packaging and Optoelectronic Fields
ZSH-500 vacuum dehydrogenation furnace

ZSH-500 vacuum dehydrogenation furnace is suitable for vacuum degassing and dehydrogenation of various metal materials and metal structures.It is also suitable for tempering of various metal materials and metal structures under vacuum or atmosphere protection.The equipment has reliable performance, accurate temperature control, simple maintenance and automatic operation.The process control computer is equipped with touch screen, which is convenient for users to operate, edit process icon and store formula.The utility model has the advantages of high production efficiency and low energy consumption.It has the advantages of less pollution, convenient maintenance and use.The temperature uniformity of the furnace can reach ± 5 ºC in the temperature range of 150 ºC to 500 ºC .
Zbs-300d Vacuum Baking Equipment for Mems, Power Semiconductor, Advanced Packaging and Optoelectronic Fields

ZBS-500 vacuum baking equipment

ZBS-500 vacuum baking equipment can realize the vacuum drying, baking, exhaust and other pretreatment of the shell and chip, and can also realize the workpiece atmosphere (such as nitrogen) or vacuum baking, annealing, oxidation, dehydrogenation and other processes in a clean environment.It is suitable for MEMS, power semiconductor, advanced packaging,optoelectronics and other fields. It can be heated and baked at constant temperature for a long time. The working temperature can reach 500 ºC . It also has excellent temperature uniformity and integrated heating and cooling plate control technology.The equipment has reliable performance, accurate temperature control, simple maintenance and automatic operation.The process control computer is equipped with touch screen, which is convenient for users to operate, edit process icon and store 
formula.
Zbs-300d Vacuum Baking Equipment for Mems, Power Semiconductor, Advanced Packaging and Optoelectronic Fields
ZBS-300D vacuum baking equipment

ZBS-300D vacuum baking equipment can realize the pre-treatment of shell and chip in vacuum, such as drying and exhausting, and realize the process of workpiece atmosphere (such as nitrogen) or vacuum baking, annealing, oxidation and dehydrogenation in a clean environment. It is suitable for MEMS, power semiconductor, advanced packaging and optoelectronic fields.It can be heated for a long time and baked at constant temperature. The working temperature can reach 400 ºC , and it has excellent temperature uniformity.The equipment has reliable performance, accurate temperature control, simple maintenance and automatic operation.The process control computer is equipped with touch screen, which is convenient for users to operate, edit process icon and store formula.

 

Exhibition & Customers

Zbs-300d Vacuum Baking Equipment for Mems, Power Semiconductor, Advanced Packaging and Optoelectronic FieldsZbs-300d Vacuum Baking Equipment for Mems, Power Semiconductor, Advanced Packaging and Optoelectronic FieldsJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

Zbs-300d Vacuum Baking Equipment for Mems, Power Semiconductor, Advanced Packaging and Optoelectronic Fields
FAQ
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 
 
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

 
 

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

 

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